Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer

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概要

• 論文の詳細を見る
• 2004-02-20

著者

• LIN Kwang-Lung

  Department of Materials Science and Engineering, National Cheng Kung University

• Lin Kwang-lung

  Department Of Materials Science And Engineering National Cheng Kung University

• HUANG Chia-Wei

  Department of Materials Science and Engineering, National Cheng Kung University

• Huang Chia-wei

  Department Of Materials Science And Engineering National Cheng Kung University

関連論文

• ZrAl_3 Intermetallic Compound Thin Film as a Diffusion Barrier between Al and Au Layers
• Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer
• Solderability of Electroless Nickel Alloys Using Wetting Balance Technique
• Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys
• Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys
• Wetting Kinetics and the Interfacial Interaction Behavior between Electroless Ni-Cu-P and Molten Solder

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