Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2004-03-20
著者
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Song Jenn-ming
Department Of Materials Science And Engineering National Cheng Kung University
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Lin Kwang-lung
Department Of Materials Science And Engineering National Cheng Kung University
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LIU Nai-Shuo
Department of Materials Science and Engineering, National Cheng Kung University
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Liu Nai-shuo
Department Of Materials Science And Engineering National Cheng Kung University
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- A Study on Electro-Discharge Machined Surfaces of Ferritic SG Cast Irons
- Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates
- ZrAl_3 Intermetallic Compound Thin Film as a Diffusion Barrier between Al and Au Layers
- Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer
- Solderability of Electroless Nickel Alloys Using Wetting Balance Technique
- Faceting Behavior of Primary Ag in Bi-Ag Alloys for High Temperature Soldering Applications
- Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys
- Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys
- Wetting Kinetics and the Interfacial Interaction Behavior between Electroless Ni-Cu-P and Molten Solder