Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2005-01-20
著者
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Lin Kwang-lung
Department Of Materials Science And Engineering National Cheng Kung University
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Lin Kwang-lung
Department Of Materials Science And Engineering National Cheng-kung University
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CHENG Shou-Chang
Department of Electronics Engineering and Computer Science, Tung-Fang Institute of Technology
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Cheng Shou-chang
Department Of Electronics Engineering And Computer Science Tung-fang Institute Of Technology
関連論文
- ZrAl_3 Intermetallic Compound Thin Film as a Diffusion Barrier between Al and Au Layers
- Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer
- Solderability of Electroless Nickel Alloys Using Wetting Balance Technique
- Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys
- Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys
- Wetting Kinetics and the Interfacial Interaction Behavior between Electroless Ni-Cu-P and Molten Solder