Study of Tin Diffusion into Silicon by Backscattering Analysis
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概要
- 論文の詳細を見る
Diffusion of tin into Si from tin-doped oxide is studied by the backscattering and channeling analyses. The depth distribution of tin in Si can be fitted to complementary error functions. The diffusion coefficient can be expressed as D=0.054 exp(-3.5eV/kT). The solubility limit in Si and the segregation constant between Si and SiO_2 are estimated to be 6〜8×10^<19>/cm^3 and 0.066 at 1100℃〜1200℃, respectively. The lattice location of tin in Si is also determined by angular scan, and it is found that more than 90% of tin atoms occupy substitutional sites. Uniformity of the concentration over a silicon wafer is also checked with the microanalysis system by using backscattering and is found to be good. Effect of post-diffusion of phosphorous or boron on the depth profile of tin is also studied.
- 社団法人応用物理学会の論文
- 1974-10-05
著者
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Horie Kazuo
Lsi Development Laboratory Mitsubishi Electric Corporation
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Akasaka Youichi
Lsi Development Laboratory Mitsubishi Electric Corporation
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Nakamura Genshiro
Kitaitami Works Mitsubishi Electric Corporation
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Yukimoto Yoshinori
Kitaitami Works Mitsubishi Electric Corporation
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AKASAKA Youichi
Central Research Laboratory, Mitsubishi Electric Corporation
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HORIE Kazuo
Central Research Laboratory, Mitsubishi Electric Corporation
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TSUKAMOTO Katsuhiro
Central Research Laboratory, Mitsubishi Electric Corporation
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Tsukamoto Katsuhiro
Lsi Development Laboratory Mitsubishi Electric Corporation
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