微小穴を有する金属レーザー照射による融解・流動・凝固

概要

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Recently, a technique for metallization and integration of VLSI such as plug formation and planarization of viahole by a laser induced melting has been attracting a growing interest. In order to obtain fundamental knowledge for improving reliability of metallization and integration of VLSI, this process, a pure metal with a microscopic hole is melted by the laser irradiation from above and the molten metal flows into the hole and then solidifies, was investigated numerically and experimentally. In the analysis, the surface tension was taken into account because the size of the hole is very small. Distributions of velocity and pressure in the molten metal with a free surface were calculated by MAC method. For calculations of the distribution of temperature and a phase change process, the explicit finite difference method and conventional method were used, respectively. From numerical and experimental results, it was shown that the present analysis can qualitatively simulate the above process. The analysis performed for the same hole size and time scale as the practical process of plug formation and planarization of viahole also showed transient behavior of metal from the melting to solidification. As a conclusion, it was clarified that the surface tension mainly governs the flow of the molten metal into the microscopic hole.
日本シミュレーション学会の論文
1994-09-15