Influence of Thernal Stress on Contact Resistance of Mounted Electrical Contacts on Printed Circuit Board (国際セッションIS-EMD2002〔英文〕)
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概要
- 論文の詳細を見る
In this study, the measured results are presented on the contact resistance of mounted electrical contacts on the printed circuit board (PCB) surface due to thermal stress, along with the measurement of the deformation of PCB surface due to thermal stress by applying the Holographic Pattern Measuring System (HPMS). Some variations are shown of the contact resistance due to thermal stressed PCB deformation that was quantitatively measured by using the HPMS, which were difficult so far by the other conventional methods. In additions, we have had some relationship between the contact resistance and the micro displacement of the contact point which relates a michro-scopic displacement of contact point due to thermal deformation of PCB.
- 社団法人電子情報通信学会の論文
- 2002-11-07
著者
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Ishida H
Tohoku Bunka Gakuen Univ. Sendai Jpn
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ISHIDA Hiroyuki
Faculty of Science, Okayama University
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TANIGUCHI Masanari
Tohoku Bunka Gakuen University
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TANIGUCHI Masanari
Faculty of Science and Technology, Tohoku Bunka Gakuen University
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TAKAGI Tasuku
Faculty of Science and Technology, Tohoku Bunka Gakuen University
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Takagi Tasuku
Tohoku University
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Takagi Tasuku
Faculty Of Engineering Tohoku University
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Taniguchi Masanari
Faculty Of Science And Technology Tohoku Bunka Gakuen University
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Ishida Hiroyuki
Faculty of Engineering, Electronic Engineering, Tohoku University, Sendai 982
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