111 段付き複合曲げ振動棒を用いた超音波複合振動溶接装置の構成について : 複合振動を用いた電子デバイスの超音波溶接について

概要

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Two-dimensional ultrasonic complex vibrations are effective for various ultrasonic high power applications. Ultrasonic complex vibration systems of 40kHz to 180kHz with a welding tip vibrating elliptical to circular locus for packaging in microelectronics were studied. Complex vibration are effective and essential for welding of various specimens including the same and different metal specimens, and for direct welding of semiconductor tips and packaging of various electronic devices without solder. The complex vibration sources consist of a complex transverse vibration rod that is driven by two longitudinal vibration source crossed at a right angle. The two driving longitudinal vibration transducers are driven two independent power amplifiers with phase difference 90°. The large-area welding tip is installed at the free edge of the complex vibration rod. The transverse rod has several stepped parts for amplifying vibration velocity. As several examples of packaging in microelectronics, direct bonding of small tip parts, sealing of ceramic cases with KOVAR plates and flip-chip bonding of semiconductors were tested.
一般社団法人日本機械学会の論文
2003-06-04