マイクロピンフィンを有するシリコンチップ上のFC-72の沸騰熱伝達 : フィン高さとフィン厚さの複合効果

概要

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Experiments were perfomed to study the combined effects of the height and thickness of micro-pin-fin on boiling heat transfer from silicon chips immersed in a pool of degassed or gas-dissolved FC-72. Six kinds of square micro-pin-fins with the dimensions of 30×60, 30×120, 30×200, 50×60, 50×200 and 50×270μm^2 (thickness t×height h) were fabricated on the surface of a square silicon chip with the dimensions of 10×10×0.5mm^3 by use of the dry etching technique. The fin pitch was twice the fin thickness. The experiments were conducted at the liquid subcooling ΔT_<sub> of 0, 3, 25 and 45K under the atmospheric condition. The results were compared with previous results for a smooth chip and three chips with enhanced surfaces. The micro-pin-finned chips showed a considerable heat transfer enhancement in the nucleate boiling region and increase in the critical heat flux q_<CHF> as compared to the smooth chip. The wall temperature at the CHF point was always less than the maximum allowable temperature for LSI chips (=85℃). For a fixed value of t, q_<CHF> increased monotonically with increasing h. The increase was more significant for larger t. The q_<CHF> increased almost linearly with increasing ΔT_<sub>. The maximum value of allowable heat flux q_<max> (=84.5W/cm^2), 4.2 times as large as that for the smooth chip, was obtained by the chip with h=270μm and t=50 μm at ΔT_<sub>=45K.
一般社団法人日本機械学会の論文
2003-03-25