D233 冷媒自然循環方式による LSI チップの沸騰冷却に関する研究 : 伝熱性能におよぼすチップ取り付け位置の影響

概要

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Experiments were conducted to study the effect of the location of LSI chip on the heat transfer performance of a natural circulation, evaporative cooling system for LSI chip. A test silicon chip with dimensions of 10×10×0.5(mm)^3 was mounted on the bottom surface of a horizontal rectangular duct located at the bottom of the natural circulation loop in which FC-72 was filled. The space height of the duct s was set at 1,10 and 25mm. A smooth chip and a chip with square micro-pin-fins were tested. Experiments were conducted at the liquid subcooling ΔT_<sub> of 10,25 and 35K. Comparison of the results revealed that the highest performance was obtained by the micro-pin-finned chip with s=10mm.
一般社団法人日本機械学会の論文
2003-11-10