レーザプレーティングによるセラミック基板への金属薄膜の空間選択形成に関する研究

概要

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This paper describes the feasibility of selective area deposition of metal thin films onto ceramic substrates by using a laser-induced plating technique. In experiments, a focused YAG laser beam and a copper electroless plating solution including CuSO_4 were used. For the ceramic workpieces, aluminum nitride (AlN) substrate without activation was used. As a result, a copper deposit was produced on the ceramic surface only in regions where the laser beam was irradiated. A very high plating rate of about 2 μm/s was achieved. This plating enhancement rate is about 1×10^3 times the usual plating rate. The specific resistance of the copper film was about 3×10^<-8> Ωm. As an application, the direct drawing of copper lines was demonstrated with a writing speed of 0.2 mm/s.
一般社団法人日本機械学会の論文
1989-07-25