高温における単結晶シリコンの脆性-延性遷移と切削加工への応用

概要

論文の詳細を見る
In this paper we describe the mechanism of brittle ductile transition of monocrystal silicon at a high temperature and its feasibility for ductile mode cutting. Micro-Vickers indentation tests were carried out at various temperatures, and for various indenting loads and speeds. The critical indenting speed at a fixed load, which causes cracks to form in the material surface layer, directly depends on the material temperature and load rates. The micro-cutting test were carried out at high temperatures by applying the temperature dependence of the critical indenting speed. The critical depth of cut is closely related to the material temperature and cutting speed. When the material temperature surpassed 883 K at a cutting speed of 1 mm/s, the critical depth of cut quickly increased by about six times that at room temperature.
一般社団法人日本機械学会の論文
1998-05-25