単結晶シリコンの切削加工に関する研究 : 第1報,脆性-延性遷移に伴う加工表面性状の変化

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During the machining of brittle materials, the brittle-ductile transition (B-D-T) is related to the machining conditions. In this paper, micro-cutting is carried out to investigate the effect of B-D-T on the surface integrity of silicon single crystals. Surface texture, residual stress and crystal properties of the machined surface are evaluated with a surface roughness tester, scanning electron microscopy, atomic force microscopy and micro-Raman spectroscope. Results are as follows : (1) For the ductile mode cutting surface, the surface roughness of 0.005 μm Ra, compressive residual stress of 23.0 MPa, surface topography and crystal properties are nearly the same as that of the polishing surface. (2) For the brittle mode cutting surface, the value of the surface roughness Ra is much larger than that of the polishing surface, as is the compressive residual stress at the value of 172.5 MPa. (3) The value of the critical material removal rate, ΔV_c, for ductile mode cutting, as well as the critical depth of cut, becomes smaller with the increase of feedrate.
一般社団法人日本機械学会の論文
1993-01-25