A Fundamental Study on the Copper Electroplating Method of Stress Analysis : Occurrence of Slip Bands in Plating Foil under Variable Stresses
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概要
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In this paper, fundamental experiments are carried out to examine the occurrence of slip bands (flecks) in a copper electroplating foil under variable stresses. The following conclusions are drawn: (1) Miner's rule holds for the occurrence of slip bands under two-level single block stressing; (2) the appearance of slip bands is dominated by the amplitude of the plating foil, cumulative fatigue damage that causes the slip initiation and the grain growth in the foil is not dominated by Miner's rule; and (4) both overstressing and under stressing reduce the heating duration for recrystallization of the copper plating foil and then promote the occurrence of slip bands.
- 一般社団法人日本機械学会の論文
著者
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Nagase Yasuo
Faculty Of Engineering Nagoya University
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IZUMISAWA Masaro
Faculty of Engineering, Shizuoka University
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Izumisawa Masaro
Faculty Of Engineering Shizuoka University
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- Experimental Evaluation of the Stress Intensity Factor Using the Phenomena of Grain Growth and Slip-initiation in Copper Foil
- A Fundamental Study on the Copper Electroplating Method of Stress Analysis : Occurrence of Slip Bands in Plating Foil under Variable Stresses
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- A Fundamental Study on the Copper Electroplating Method of Stress Analysis : Frequency-Dependence of Grain Growth and Slip-Initiation : Series A : Solid-Mechanics, Strength of Materials