A Fundamental Study on the Copper Electroplating Method of Stress Analysis : Frequency-Dependence of Grain Growth and Slip-Initiation : Series A : Solid-Mechanics, Strength of Materials
スポンサーリンク
概要
著者
-
Nagase Yasuo
Faculty Of Engineering Nagoya University
-
Nagase Yasuo
Faculty Of Engineering Shizuoka University
-
Izumisawa Masaro
Faculty Of Engineering Shizuoka University
-
FUKUI Kazuyasu
Yoshiwara Technical High School
-
NAGASE Yasuo
Faculty of Engineering, Shizuoka University
関連論文
- Fatigue Gauge Utilizing Slip Deformation of Aluminum Foil : Effect of Material Factor on the Evolution of Roughness
- Fatigue Gauge Utilizing Slip Deformation of Aluminum Foil : Slip Initiation and Surface Roughening Phenomena under Uniaxial Stressing
- On the Temperature- and cyclic speed-dependence of the Method of Stress Measurement Using Iron-foils
- Stress Measurement Using Slip-initiation Phenomenon in Iron Foil
- Basic Study on Stress Measurement Using Slip-initiation Phenomenon in Electro-deposited Iron
- Experimental Evaluation of the Stress Intensity Factor Using the Phenomena of Grain Growth and Slip-initiation in Copper Foil
- A Fundamental Study on the Copper Electroplating Method of Stress Analysis : Occurrence of Slip Bands in Plating Foil under Variable Stresses
- Measurement of Cyclis Stresses Caused in High Temperature Range by Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating
- Basic Study on Foil Strain Gauges Made of Electrodeposited Copper or Nickel
- Fundamental Studies on the Copper and Nickel Electroplating Methods of Stress Analysis : Effects of the Ground Plating on the Proper Stress
- A Basic Study on Fatigue Gauge Made of Electroplated Copper Foil : Effects of Understress
- A Fundamental Study on the Copper Electroplating Method of Stress Analysis : Frequency-Dependence of Grain Growth and Slip-Initiation : Series A : Solid-Mechanics, Strength of Materials