A Basic Study on Fatigue Gauge Made of Electroplated Copper Foil : Effects of Understress
スポンサーリンク
概要
- 論文の詳細を見る
Fundamental investigations are made regarding the phenomena of slip band initiation and grown grain initiation in an electroplated copper foil under variable amplitude stress which consists of overstress and understress. The applicability of the copper foil to the fatigue gauge which detects fatigue damage is discussed. It is found that the modified Miner's rule does not hold for the slip band and grown grain initiation under two-level single block loading and two-level multiple loading composed of overstress and understress. The cumulative cycle ratio in these cases is dependent on load history. It is also found that fatigue damage during understress applied after overstress is greater in the early period of the cycles. The deviation from the modified Miner's rule, however, can be said to be small. Furthermore, it is found that the fraction of grown grains initiated under variable stress is dependent on the equivalent stress. This enables the evaluation of the equivalent stress based on the fraction of grown grains.
- 一般社団法人日本機械学会の論文
- 1991-01-15
著者
-
Nagase Yasuo
Faculty Of Engineering Nagoya University
-
YOSHIZAKI Tatsuya
Mitsubishi Motors Co., LTD.
-
Yoshizaki Tatsuya
Mitsubishi Motors Co. Ltd.
関連論文
- Fatigue Gauge Utilizing Slip Deformation of Aluminum Foil : Effect of Material Factor on the Evolution of Roughness
- Fatigue Gauge Utilizing Slip Deformation of Aluminum Foil : Slip Initiation and Surface Roughening Phenomena under Uniaxial Stressing
- On the Temperature- and cyclic speed-dependence of the Method of Stress Measurement Using Iron-foils
- Stress Measurement Using Slip-initiation Phenomenon in Iron Foil
- Basic Study on Stress Measurement Using Slip-initiation Phenomenon in Electro-deposited Iron
- Experimental Evaluation of the Stress Intensity Factor Using the Phenomena of Grain Growth and Slip-initiation in Copper Foil
- A Fundamental Study on the Copper Electroplating Method of Stress Analysis : Occurrence of Slip Bands in Plating Foil under Variable Stresses
- Measurement of Cyclis Stresses Caused in High Temperature Range by Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating
- Basic Study on Foil Strain Gauges Made of Electrodeposited Copper or Nickel
- Fundamental Studies on the Copper and Nickel Electroplating Methods of Stress Analysis : Effects of the Ground Plating on the Proper Stress
- A Basic Study on Fatigue Gauge Made of Electroplated Copper Foil : Effects of Understress
- A Fundamental Study on the Copper Electroplating Method of Stress Analysis : Frequency-Dependence of Grain Growth and Slip-Initiation : Series A : Solid-Mechanics, Strength of Materials