B26-053 AB INITIO TENSILE TEST OF COPPER-ALUMINA INTERFACE
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概要
- 論文の詳細を見る
Ab initio tensile test of fcc-Cu(111)/Al_2O_3(0001) nano-hetero interface has been performed by using an ab initio pseudopotential method and the first-principles molecular dynamics. The adhesive and mechanical properties of the copper-alumina interfaces depended strongly on the interface stoichiometry. The non-stoichiometirc (O-terminated) interface has quite larger adhesive energy than that of the stoichiometric (Al-terminated) one, and the adhesive feature is different between two interfaces. Rigid-type tensile tests revealed the local strength of each interlayer, and developed the interlayer potentials and the effective interatomic potentials. In the O-terminated interface the Cu-O interface is twice as strong as the Cu-Cu interlayer whereas in the Al-terminated interface the Cu-Al interface is weaker than the Cu-Cu interlayer.
- 一般社団法人日本機械学会の論文
- 2003-11-30
著者
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Sakuma T
School Of Engineering University Of Tokyo
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Tanaka S
Interface Science Research Group Special Division For Green Life Technology National Institute Of Ad
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Kohyama M
Research Institute For Ubiquitous Energy Devices National Institute Of Advanced Industrial Science A
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Yang Rui
Interface Science Research Group Special Division For Green Life Technology National Institute Of Ad
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KOHYAMA Masanori
Special Division of Green Life Technology, National Institute of Advanced Industrial Science and Tec
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Tanaka Shingo
Special Division for Green Life Technology, National Institute of Advanced Industrial Science and Te
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Yang Rui
Special Division for Green Life Technology, National Institute of Advanced Industrial Science and Te
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Kohyama Masanori
Special Division Of Green Life Technology National Institute Of Advanced Industrial Science And Tech
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KOHYAMA Masanori
Department of Material Physics, Osaka National Research Institute
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