Ni-Cr合金による窒化ケイ素セラミックスと金属の固相接合

概要

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Silicon-nitride ceramics were joined to metal with an 80 mass%Ni-20 mass%Cr alloy sheet as an insert material. Joining was performed between 1323 and 1473 K in vacuum. Microstructures and growth behavior of reaction layers and the influence of annealing after joining were investigated with a scanning electron microscope and an electron probe microanalyzer. On the joints bonded at 1323-1423 K, the reaction layers including a large amount of Ni solid solution were formed, whereas the reaction layers bonded at 1473 K primarily consisted of fine chromium nitrides. Growth of reaction layers obeyed the parabolic law and rate constants (k_p) for the growth were 9.6× 10^<-16>-2.5×10^<-14>m^2/s at 1323-1473 K. The activation energy for the growth of reaction layers (Q_kp) was 305 kJ/mol. The fracture bending strength of Si_3N_4/Inconel couples showed the maximum of 590 MPa at room temperature. The joints bonded at 1343 and 1473 K were annealed at 1073 K for 720 ks in vacuum. Variations in microstructure and composition of the reaction layers of joints bonded at 1343 K were observed, and the fracture bending strength showed large degradation. On the other hand, those of joints bonded at 1473 K remained almost unchanged on annealing.
社団法人日本セラミックス協会の論文
1996-06-01