Ni基ろうによる窒化ケイ素セラミックスと金属接合体の反応層

概要

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Silicon nitride ceramics was joined to a stainless steel using a Ni-Cr-P amorphous solder (MBF65) and two MBF65 solders with Cr or Mn thin films vapor-deposited. Bonding layers were composed of a chromic silicate layer close to the ceramics surface and a duplex phases of a chromic nitride and a nickel solid solution containing small amounts of chromium and silicon. Growth of the bonding layer was parabolic at the initial stage and then slowed with decreasing in chromium contents in the solder. A parabolic rate constant of the joints with the MBF65 and MBF65-Mn solders was 1.0×10^<-15>m^2.s^<-1> at a temperature of 1333 K. Fracture strengthes increased with decreasing in thickness of the bonding layer, that is, they were 50 to 140 MPa for the joint with a MBF65 solder, 120 to 170 MPa for the joint with a MBF65-Cr solder, and 130 to 200 MPa for the joint with a MBF65-Mn solder.
社団法人日本セラミックス協会の論文
1992-07-01