単結晶シリコンの機械加工における脆性-延性遷移とその制御に関する研究 : 圧子すべり接触モデルによる遷移挙動の解析

概要

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This paper describes the basic conditions for the brittle ductile transition in the ultraprecision machining of brittle materials in order to explain the deformation and fracture mechanism of a subsurface layer illduced by the microinteraction between a tool and a material. The temperature and stress distribution were simulated by a finite element method using a indenter sliding contact model in diamond cutting of monocrystal sili con. From this analysis, the characteristics of high temperature and stress field during the microcutting of brittle materials, and also the deformation and fracture behavior were clearly understood. The stable ductile nrode machining of brittle materials is achieved by controlling the depth of cut, cutting speed and lubrication.
社団法人日本セラミックス協会の論文
1994-12-01