凝集構造制御によるTiN/Si_3N_4焼結体の機械,電気特性の最適化

概要

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Microstructure of TiN/Si_3N_4 ceramics was tailored by using a cosintering process of their agglomerates, then structure-properties relations were examined by measuring mechanical property and electrical conductivity of TiN/Si_3N_4. The TiN/Si_3N_4 material using TiN and Si_3N_4 agglomerates showed duplex microstructure. This materials showed a sudden onset of electrical conduction at a lower TiN content than that of conventional composites. The duplex materials exhibited a higher fracture toughness than that of the normal composites, while other hand its strength remained at the same level of TiN. It is concluded that higher fracture toughness of duplex materials resulted from the complex fracture path at the interface between Si_3N_4 and TiN agglomerates.
社団法人日本セラミックス協会の論文
1997-02-01