CSP のリワーク技術と信頼性

概要

論文の詳細を見る
It is expected that CSP's accept a demand of high dencity assembly in mobile tele-communication apparatus etc. We revealed that conventional process using CSP is compatible with that using SMD. We developed newly CSP repairing process that has following 4 steps ; removing defective CSP with IR lanp, uniforming solder residue, mounting transferred solder paste CSP and reflow-solderring with IR lanp. We carried out the reliability tests on the samples that CSP's were assembled by conventional process and rework process, and have got the good result in practical use on both samples. FEM simulation of assembled CSP structure using elasto-plastic model was computed. The simulation result gets almost agreement with the CSP reliability test, and has a particular behavior in comparison with DCA (Direct Chip Attach). We will continue CSP reliability data accumulation and FEM study for prediction on life time of CSP assembly apparatus.
社団法人エレクトロニクス実装学会の論文
1998-05-01