TVホログラフィ干渉法を用いためっき膜生成片持ちはりの変形測定

概要

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Recently, an electroless plating process is widely used for electronic industry. But, the plating film is often detached from the substrate owing to the internal stress. The origin of the stress in films is not certain. In order to determine the origin of stress in films, measurements of film stress are required in the earliest stages of film growth. This paper shows the possibility of applying TV holographic interferometry to such experiments. The macrostress can be obtained by measuring the bending produced in a thin substrate by the action of the film. In this study, TV holography, which can capture holographic image at TV frame rates, is used to measure sensitively the deflection of the free end of the cantilever beam. Continuous in-situ measurement of the film stress during plating was readily accomplished with this technique. The relation between film thickness and the internal stress for a Cu plating on a Be-Cu substrate wa discussed.
公益社団法人精密工学会の論文
2003-06-05