PVD 法および CVD 法により TiC を被覆した超硬合金の特性と微細構造との関係

概要

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Microstructures and microhardness of TiC films coated on WC-Co cemented carbides by CVD and PVD (ion-plating) processes were investigated by transmission electron microscopy and Vickers hardness testing. The microstructure of CVD films is granular. On the other hand, that of PVD films is columnar and each of column has strong preferred orientation. The interdiffusion between substrate and coated material was observed in CVD films by EDX analysis. The microhardness of PVD films are much higher than that of CVD films. This is considered to be mainly due to the existence of residual stress in films. High compressive residual stress in PVD films can be expected from the computer simulation by TRIM-code. The result of the simulation shows that energetic Ti and C ions are introduced into deposited film as interstitial atoms over a depth of 3 and 6 nm, respectively, in PVD process. The growth process of a film is proceeded by two simultaneous processes. One process is pile-up of Ti and C atoms on the substrate, the other process is injection of energitic Ti and C ions into deposited film.
公益社団法人精密工学会の論文
1991-10-05