Wetting balance 法をいた Pb-Sn soft solder の Cu に対するぬれ性について

概要

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In the soldering, it is well known that the base metal of joints is not melted. Generally, the soldering system can be devided into three main factors, soft solder, base metal and flux. Soft solder is in the first stage melted, in the second stage wetted and spreads over the base metal surface and finally solidificated. All these processes important in the soldering above all wettability, play an important role and have influence on the surface conditions of base metal. These facts molivated us to study the effect of surface roughness on wettability. This paper describes that the surface roughness of pure-copper base metal have influence upon the wettability of melted soft solder. In addition, it is shown that the buoyancy and adhesiveness of liquid soft solder are effected by the liquid solder bath temperature, immersion time and the solder's composition. In this study, we used both wetting balance method and spread area method for estimating wettability.
東海大学の論文