Interfacial Microstructure and Thermal Stability of Zr_<55>Cu_<30>Ni_5Al_<10> Metallic Glass Joints Formed by Ultrasonic Bonding

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2009-06-01

著者

• INOUE Akihisa

  Tohoku University

• Maeda Masakatsu

  Center For Advanced Sci. And Innovation Osaka Univ.

• Yamasaki Takao

  Center For Advanced Science And Innovation Osaka University

• TAKAHASHI Yasuo

  Center for Advanced Science and Innovation, Osaka University

• Takahashi Yasuo

  Center For Advanced Science And Innovation Osaka University

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• Special Issue on Joining Technology for New Metallic Glasses and Inorganic Materials - Selected Papers from the IUMRS International Conference in Asia 2008 (IUMRS-ICA2008)
• Interfacial Microstructure and Thermal Stability of Zr_Cu_Ni_5Al_ Metallic Glass Joints Formed by Ultrasonic Bonding
• Plastic Working of Metallic Glass Bolts by Cold Thread Rolling
• Nanoimprinting of Metallic Glass for Periodic Nano-Hole Structures with Dies Fabricated by FIB-CVD and RIE
• 414 FORMATION OF Ti_3SiC_2 ON SiC BY CONTROL OF INTERFACIAL REACTION BETWEEN SiC AND Ti/Al MULTILAYER(4th JWS-KWJS Young Reseacher Symposlum)
• Spiral Pattern Formation on Bulk Metallic Glass by Electropolishing
• Compositional Dependence of Thermal and Mechanical Properties of Quaternary Zr-Cu-Ni-Al Bulk Glassy Alloys
• Discovery of Solid Deuterium Nuclear Fusion of Pycnodeuterium-Lumps Solidified Locally Within Nano-Pd Particles
• PREFACE
• Deuterium Absorption Characteristics of Peculiar Composite Powder (Zr_3NiO・NiO)
• Relation between Vibration of Wedge-Tool and Adhesion of Wire to Substrate during Ultrasonic Bonding
• Development and Microstructure of Cu-Zr Alloy Wire with Ultimate Tensile Strength of 2.2 GPa
• Reaction between GaN and Metallic Deposition Films
• Fabrication of Molds with 25-nm Dot-Pitch Pattern by Focused Ion Beam and Reactive Ion Etching for Nanoimprint Using Metallic Glass
• Microstructures and Mechanical Properties of Highly Electrically Conductive Cu-0.5, Cu-1 and Cu-2 at% Zr Alloy Wires

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