Relation between Vibration of Wedge-Tool and Adhesion of Wire to Substrate during Ultrasonic Bonding

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概要

• 論文の詳細を見る
• 2010-01-20

著者

• Maeda Masakatsu

  Center For Advanced Sci. And Innovation Osaka Univ.

• Takahashi Yasuo

  Center For Advanced Science And Innovation Osaka University

• Matsusaka Souta

  Graduate School Of Engineering Chiba University

• YAMANE Keita

  Graduate School of Engineering, Osaka University

• Yamane Keita

  Graduate School Of Engineering Osaka University

関連論文

• Interfacial Microstructure and Thermal Stability of Zr_Cu_Ni_5Al_ Metallic Glass Joints Formed by Ultrasonic Bonding
• 414 FORMATION OF Ti_3SiC_2 ON SiC BY CONTROL OF INTERFACIAL REACTION BETWEEN SiC AND Ti/Al MULTILAYER(4th JWS-KWJS Young Reseacher Symposlum)
• Relation between Vibration of Wedge-Tool and Adhesion of Wire to Substrate during Ultrasonic Bonding
• Reaction between GaN and Metallic Deposition Films
• Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding

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