Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding
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概要
- 論文の詳細を見る
- 2013-06-01
著者
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Maeda Masakatsu
Joining And Welding Research Institute Osaka University
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Takahashi Yasuo
Joining And Welding Research Institute Osaka University
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Yamane Keita
Graduate School Of Engineering Osaka University
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KITAMURA Hideki
Graduate School of Engineering, Osaka University
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YONESHIMA Yasuhiro
Graduate School of Engineering, Osaka University
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- Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding