ベンゾトリアゾール内包マイクロカプセル複合銅めっき

概要

論文の詳細を見る
Microcapsules containing benzotriazole, which is a corrosion inhibitor of copper, were incorporated with copper electrodeposition. Spherical microcapsules were fabricated by the polymerization between terephthalic dichloride and diethylenetriamine. The average diameter of the microcapsules was 7.3μm. The microcapsule composite copper coating was carried out at 10mA cm−2 in a copper sulfate bath. The incorporation of the microcapsules in copper film was confirmed by surface observation with a confocal laser scanning microscope and scanning electron microscope. From the result of the observation, it was found that microcapsules were incorporated in the copper films. A corrosion test was investigated for the microcapsule composite copper coating films in 100ppm sulfuric acid solution containing 100ppm chloride ion for 1month. Local corrosion was not observed on the surface of the coating films after the corrosion test. The weight of the coating film did not change. From these results, it was found that the copper film incorporated with microcapsules has good corrosion resistance.
一般社団法人表面技術協会の論文
2008-03-01