大気圧プラズマジェット照射による銅ワイヤー絶縁被膜の局所剥離

概要

論文の詳細を見る
The localized removal of a polyamid-imide (PAI) insulator films (thickness of 10 μm) coated on a copper winding wire of 90 μm diameter using an atmospheric-pressure microplasma jet (APμPJ) was investigated. The APμPJs of Ar and Ar/O2 gases were generated from the tip of a stainless steel surgical needle having outer/inner diameters of 0.4/0.2 mm by a RF excitation of 13.56 MHz. The insulator films around the copper wire were completely removed by the plasma irradiation from a certain direction without fusing the wire. The removal time decreased with increasing rf power and/or by O2 addition (5%). The removal mechanism of the PAI films was attributed to chemical etching by atomic oxygen radicals. The removal time was only 3 s at an Ar flow rate of 200 ml/min and a RF power of 4 W. Fluorescence microscopy and scanning electron microscopy images revealed that good selectivity of the insulator film to the copper was achieved.
日本真空協会の論文
2008-03-20