Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2006-03-20
著者
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Furusawa Akio
Jisso Core Engineering Laboratory Matsushita Electric (panasonic)
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Saitoh Mitsuo
Production Core Engineering Laboratory Matsushita Electric (panasonic)
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Suetsugu Kenichiro
Jisso Core Engineering Laboratory Matsushita Electric (panasonic)
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OKUMURA Tomohiro
Production Core Engineering Laboratory, Matsushita Electric (Panasonic)
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NISHIKAWA Kazutaka
Production Core Engineering Laboratory, Matsushita Electric (Panasonic)
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Okumura Tomohiro
Production Core Engineering Laboratory Matsushita Electric (panasonic)
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Nishikawa Kazutaka
Production Core Engineering Laboratory Matsushita Electric (panasonic)
関連論文
- Non-Equilibrium Thermodynamic Theory of 4-Component Lead-Free Solder
- Liquidus Temperature Design of Lead-Free Solder
- Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand
- Fine Pattern Etching of Molybdenum Thin Film and Silicon Substrate by Using Atmospheric Line-Shaped Microplasma Source
- Elongated Inductively Coupled Thermal Plasma Torch Operable at Atmospheric Pressure
- Fine Pattern Etching of Silicon Substrates Using Atmospheric Line-Shaped Microplasma Source
- Elongated Inductively Coupled Thermal Plasma Torch Operable at Atmospheric Pressure (Special Issue : Dry Process)