Stress Analyses during Chemical Mechanical Planarization Processing with Cu/Porous Low-k Structures of LSI Devices
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-12-30
著者
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HIYAMA Hirokuni
Ebara Research Corp.
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KODERA Masako
Advanced Technology Division, Precision Machinery Company, Ebara Corp.
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FUKUDA Akira
Physical Research Laboratry, Ebara Research Corp.
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MOCHIZUKI Yoshihiro
Physical Research Laboratry, Ebara Research Corp.
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HIYAMA Hirokuni
Physical Research Laboratry, Ebara Research Corp.
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TOKUSHIGE Katsuhiko
Advanced Technology Division, Precision Machinery Company, Ebara Corp.
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FUKUNAGA Akira
Advanced Technology Division, Precision Machinery Company, Ebara Corp.
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TSUJIMURA Manabu
Advanced Technology Division, Precision Machinery Company, Ebara Corp.
関連論文
- Shear Stress Analyses in Chemical Mechanical Planarization Processing with Cu/porous low-k Structure
- Stress Analyses during Chemical Mechanical Planarization Processing with Cu/Porous Low-k Structures of LSI Devices
- Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing
- Pumping Effect in an Axially Vibrating Choke Nozzle : Pump Performance
- The Effect of Pumping in a Vertically Vibrating Pipe : Experimental Study on Flow Mechanism in a Pump
- Removal Rate Simulation of Dissolution-Type Electrochemical Mechanical Polishing
- Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing
- Stress Analyses during Chemical Mechanical Planarization Processing with Cu/Porous Low-$k$ Structures of LSI Devices