Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing
スポンサーリンク
概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-12-30
著者
-
FUKUNAGA Akira
Advanced Technology Division, Precision Machinery Company, Ebara Corp.
-
TSUJIMURA Manabu
Advanced Technology Division, Precision Machinery Company, Ebara Corp.
-
KODERA Masako
BEOL Process Development Deptartment 5, Process and Manufacturing Engineering Center, Toshiba Semico
-
NISHIOKA Yukiko
Advanced Technology Division, Ebara Corp.
-
SHIMA Shohei
Advanced Technology Division, Ebara Corp.
関連論文
- Stress Analyses during Chemical Mechanical Planarization Processing with Cu/Porous Low-k Structures of LSI Devices
- Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing
- Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing