Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate

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Effects of Zn-bearing flux on joint reliability and microstructure of Sn-3.5Ag soldering on electroless Ni-Au surface finish (Special issue on lead-free and advanced interconnection materials for electronics)
Atomic Structure of Pd-Intercalated Graphite by High-Resolution Electron Microscopy and First Principles Calculations
Effect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder
Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder
Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder
Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish
Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux : Strength, Microstructure and Mechanism of Improvement
Effect of Internal Structure on Thermal Properties of Alumina/Aluminum Composites Fabricated by Gelate-Freezing and Partial-Sintering Process, Respectively
Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application
Effect of Ag Content on Properties of Sn-Ag Binary Alloy Solder
Synthesis and structures of iron nanoparticles coated with boron nitride nanomaterials
PREFACE
PREFACE
Special Issue on Lead-Free Soldering in Electronics
Effect of Void Volume and Silver Loading on Strain Response of Electrical Resistance in Silver Flakes/Polyurethane Composite for Stretchable Conductors (Special Issue : Applied Physics on Materials Research)

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