Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux : Strength, Microstructure and Mechanism of Improvement
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2005-11-20
著者
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SAKURAI Hitoshi
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
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KUMAMOTO Seishi
Electronics Materials Division, Research and Development Group, Harima Chemicals, Inc
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SUGANUMA Katsuaki
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
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Ikeda Kazuki
Electronics Materials Division Research And Development Group Harima Chemicals Inc.
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Sakurai Hitoshi
Department Of Adaptive Machine Systems Graduate School Of Engineering Osaka University
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KUMAMOTO Seishi
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
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SAKURAI Hitoshi
Electronics Materials Division, Research and Development Group, Harima Chemicals, Inc.
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Kumamoto Seishi
Electronics Materials Division Research And Development Group Harima Chemicals Inc
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Suganuma Katsuaki
Department Of Adaptive Machine Systems Graduate School Of Engineering Osaka University
関連論文
- Effects of Zn-bearing flux on joint reliability and microstructure of Sn-3.5Ag soldering on electroless Ni-Au surface finish (Special issue on lead-free and advanced interconnection materials for electronics)
- Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder
- Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish
- Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
- Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux : Strength, Microstructure and Mechanism of Improvement