Effects of Zn-bearing flux on joint reliability and microstructure of Sn-3.5Ag soldering on electroless Ni-Au surface finish (Special issue on lead-free and advanced interconnection materials for electronics)
スポンサーリンク
概要
著者
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SAKURAI Hitoshi
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
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KUKIMOTO Youichi
Electronics Materials Division, Research and Development Group, Harima Chemicals, Inc
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KIM Seongjun
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
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BAATED Alongheng
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
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LEE Kiju
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
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KIM Keun-Soo
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
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KUMAMOTO Seishi
Electronics Materials Division, Research and Development Group, Harima Chemicals, Inc
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SUGANUMA Katsuaki
Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
関連論文
- Effects of Zn-bearing flux on joint reliability and microstructure of Sn-3.5Ag soldering on electroless Ni-Au surface finish (Special issue on lead-free and advanced interconnection materials for electronics)
- Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder
- Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish
- Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
- Isolation and Characterization of CO_2-Fixing Hydrogen-Oxidizing Marine Bacteria
- Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux : Strength, Microstructure and Mechanism of Improvement