Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2008-07-01
著者
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SUGANUMA Katsuaki
Institute of Scientific and Industrial Research, Osaka University
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KIM Keun-Soo
Institute of Scientific and Industrial Research, Osaka University
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Kim Keun-soo
Institute Of Scientific And Industrial Research Osaka University
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Kang Chung-yun
Department Of Materials Engineering Pusan National University
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Kang Chung-yun
Department Of Material Science And Engineering Pusan National University
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KIM SEONG-JUN
Department of Civil, Earth and Environmental Engineering, Chonnam National University
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KIM Sun-Sik
Institute of Scientific and Industrial Research, Osaka University
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Kim Sun-sik
Institute Of Scientific And Industrial Research Osaka University
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Kim Seong-jun
Department Of Adaptive Machine Systems Graduate School Of Engineering Osaka University
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Suganuma Katsuaki
Institute Of Scientific And Industrial Research Osaka University
関連論文
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- Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder
- Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
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- Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application
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- PREFACE
- PREFACE
- Special Issue on Lead-Free Soldering in Electronics
- Effect of Void Volume and Silver Loading on Strain Response of Electrical Resistance in Silver Flakes/Polyurethane Composite for Stretchable Conductors (Special Issue : Applied Physics on Materials Research)