Special Issue on Lead-Free Soldering in Electronics
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2004-03-20
著者
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SUGANUMA Katsuaki
Institute of Scientific and Industrial Research, Osaka University
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Suganuma Katsuaki
Institute Of Scientific And Industrial Research Osaka University
関連論文
- Atomic Structure of Pd-Intercalated Graphite by High-Resolution Electron Microscopy and First Principles Calculations
- Effect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder
- Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder
- Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder
- Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
- Effect of Internal Structure on Thermal Properties of Alumina/Aluminum Composites Fabricated by Gelate-Freezing and Partial-Sintering Process, Respectively
- Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application
- Effect of Ag Content on Properties of Sn-Ag Binary Alloy Solder
- Synthesis and structures of iron nanoparticles coated with boron nitride nanomaterials
- PREFACE
- PREFACE
- Special Issue on Lead-Free Soldering in Electronics
- Effect of Void Volume and Silver Loading on Strain Response of Electrical Resistance in Silver Flakes/Polyurethane Composite for Stretchable Conductors (Special Issue : Applied Physics on Materials Research)