Effect of Back-Etching on Residual Stress in Lead Titanate Thin Films on Si Wafer
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-09-30
著者
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石川 賢司
静大電子研
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鈴木 久男
静岡大学 創造科学技術大学院
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Ishikawa K
Department Of Organic And Polymeric Materials Tokyo Institute Of Technology
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石川 賢司
Shinshu Univ. Nagano Jpn
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Ohno Tomoya
Department Of Material Science Graduate School Of Engineering Shizuoka University
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ISHIKAWA KENJI
Faculty of Policy Management, Yokkaichi University
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SUZUKI HISAO
Department of Material Science, Graduate School of Engineering, Shizuoka University
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OHNO TOMOYA
Innovative Joint Research Center, Shizuoka University
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FUJIMOTO MASAYUKI
Innovative Joint Research Center, Shizuoka University
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MASUI Hirohisa
Shizuoka Industrial Research Institute of Shizuoka Prefecture
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鈴木 久男
静岡大 創造科学技術大学院
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