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Welding Research Institute of Osaka Univ. | 論文
- Influence of Substrate Biasing on (Ba, Sr)TiO_3 Films Prepared by Electron Cyclotron Resonance Plasma Sputtering
- Morphology and Microstructure of Hard and Superhard Zr-Cu-N Nanocomposite Coatings
- Measurement of Ion Temperature in Electron Cyclotron Resonance Plasma
- Saturation Behavior of Balmer-Line Fluorescences in a Hydrogen Plasma
- Nitrogen Content of 316L Weld Metal and Its Fine Particle by Means of High-pressure MIG Arc Welding
- Hydroxyapatite Film Formation by Aerosol Deposition Method(Physics, Processes, Instruments & Measurements, INTERNATIONAL SYMPOSIUM OF JWRI 30TH ANNIVERSARY)
- Toughness Characteristics and Its Improvement of Electroslag Weld Metal of Structural Steel Plate
- Influence of Local Feature of Electron Cyclotron Resonance Plasma on the Formation of Amorphous Hydrogenated Silicon Films
- Local Structure of ECR Process Plasma
- Effect of Microstructure on Fracture Toughness of SUS329J1 Duplex Stainless Steel Welds
- Deposition of Hydroxyapatite Film on Titanium by Ultra-fine Particle Beam(Physics, Processes, Instruments & Measurements)
- Effects of δ Ferrite Morphology on Low Temperature Fracture Toughness of SUS304L Steel Weld Metal
- Oxygen Content and Fracture Toughness of MIG Weld Metal of SUS304 Steel
- Production of Fast Neutral Lithium Beam for High Temperature Plasma Probing
- Research of a Stationary High Power Microwave Plasma at Atmospheric Pressure
- Experimental Investigation of Coaxial Microwave Plasmatron in Nitrogen Gas
- Friction Welding of Copper-Tungsten Sintered Alloy to Pure Aluminum : Formation of Intermetallic Compound at Weld (Report 1)
- Friction Welding Of Copper-Tungsten Sintered Alloy to Pure Titanium : Formation of Intermetallic Compound at Weld (Report 2)
- Friction Welding of Copper-Tungsten Sintered Alloy to Pure Aluminum : Formation of Intermetallic Compound at Weld (Report 1)
- Friction Welding of Oxygen Free Copper to Pure Aluminum