スポンサーリンク
The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan | 論文
- Structural and Magnetic Properties of Fe and Au Ion-Implanted Al2O3 Single Crystals
- Ultra-Low Power Event-Driven Wireless Sensor Node Using Piezoelectric Accelerometer for Health Monitoring
- Modified Diffusion Bonding of Chemical Mechanical Polishing Cu at 150 °C at Ambient Pressure
- Impact of Reflow on the Output Characteristics of Piezoelectric Microelectromechanical System Devices
- Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology
- Controlling Anion Composition at Metal--Insulator--Semiconductor Interfaces on III--V Channels by Plasma Processing
- Neutral Particle Transport Simulation around a V-Shaped Target Using DEGAS 2 Code
- Three-Dimensional Nanostructure Fabrication by Controlling Downward Growth on Focused-Ion-Beam Chemical Vapor Deposition
- Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation
- Application of a Temperature Gradient Type Thermal Probe to the Discharge Plasma
- Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure
- Frictional Property of Hydrogels Prepared under Electric Fields