スポンサーリンク
Osaka Prefecture Univ. Sakai‐shi Jpn | 論文
- lCA Based Blind MIMO OFDM Receiver
- Multiuser data separation for short message service using ICA (通信方式)
- Multiuser data separation for short message service using ICA (回路とシステム)
- Multiuser data separation for short message service using ICA (信号処理)
- An Analysis on Minimum Searching Principle of Chaotic Neural Network (Special Section of Selected Papers from the 8th Karuizawa Workshop on Circuits and Systems)
- Fractionally Spaced Bayesian Decision Feedback Equalizer(Regular Section)
- PAPR Reduction for PCC-OFDM Systems Using Neural Phase Rotator
- A New Class of Acoustic Echo Cancelling by Using Correlation LMS Algorithm for Double-Talk Condition(Speech/Acoustic Signal Processing)(Digital Signal Processing)
- A New Frequency Domain Implementation of ECLMS Algorithm for Double-Talk Echo Canceling
- Detection of Leak Location in a Pipeline by Acoustic Signal
- A-10-5 Discontinuity detection of steel pipe with PN code sound signal
- Application of a Noise-Smoothing Filter Based on Adaptive Windowing to Penumbral Imaging
- Sliding Mode Control of Windmill Power Systems via H^∞ Design
- A Design Method of an Adaptive Joint-Process IIR Filter with Generalized Lattice Structure
- New Technologies of KrF Excimer Laser Lithography System in 0.25 Micron Complex Circuit Patterns (Special Issue on Quarter Micron Si Device and Process Technologies)
- Quarter Micron KrF Excimer Laser Lithography (Special Issue on Sub-Half Micron Si Device and Process Technologies)
- 29aSJ-11 Neutron beta decay in effective field theory
- An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filters for Mobile Communication (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
- Microwave Characteristics of Alumina-Glass Composite Multi-Layer Substrates with Co-fired Copper Conductors (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
- Low-Temperature Reactive Ion Etching for Multi-Layer Resist (Special Issue on Sub-Half Micron Si Device and Process Technologies)