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Fracture And Reliability Research Institute Graduate School Of Engineering Tohoku University | 論文
- Quantitative NDE of Surface Cracks in Ceramic Materials by means of a High-Frequency Electromagnetic Wave
- Creep Damage Process of Ni-Base Superalloy Caused by Stress-Induced Anisotropic Atomic Diffusion
- Effect of Temperature on the Microscopic Appearance of the Fracture Surface of Alloy 690TT under SSRT Testing(Macro-, Micro-, Meso-, and Nano-scopic Strength of Materials Relating to Microstructures)
- Investigation of Mask Deformation by Oxygen-Radical Irradiation during Resist Trimming
- Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structures
- Effect of Residual Stress in Thin Films on the Radiation Spectrum of a Semiconductor Laser
- Creation of a Degraded Layer on the Surface of Photoresist by Radical Irradiation
- Ionic Conductivity in Uniaxial Micro Strain/Stress Fields of Yttria-Stabilized Zirconia
- Improvement of Crystallographic Quality of Electroplated Copper Thin-Film Interconnections for Through-Silicon Vias
- Investigation of Mask Inclination Due to Oxygen-Radical Irradiation during Resist Trimming
- Fatigue Strength of Electroplated Copper Thin Films under Uni-Axial Stress