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Department of Materials Science and Engineering Hongik University | 論文
- Spheroidization of Low Carbon Steel Processed by Equal Channel Angular Pressing
- Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys
- Pectolinarin and Pectolinarigenin of Cirsium setidens Prevent the Hepatic Injury in Rats Caused by D-Galactosamine via an Antioxidant Mechanism(Pharmacognosy)
- Thermoelectric Characteristics of the Thermopile Sensors with Variations of the Width and the Thickness of the Electrodeposited Bismuth-Telluride and Antimony-Telluride Thin Films
- Electrical Characteristics of the Pt/SrBi_Ta_2O_9/ZrO_2/Si Structure for Metal-Ferroelectric-Insulator-Semiconductor Field-Effect-Transistor Application
- Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint
- Prediction of Effective Thermal Diffusivity of Fish and Meats
- Protective Effects of Decursin and Decursinol Angelate against Amyloid β-Protein-Induced Oxidative Stress in the PC12 Cell Line : The Role of Nrf2 and Antioxidant Enzymes
- Formation of Barrier Ribs for Plasma Display Panel via Capillary Molding—Effects of Sintering Conditions on Barrier Rib Morphology
- Joule-Heating-Induced Annealing by Applying Electric Field Directly to Intrinsic Silicon Film
- Association between Short Sleep Duration and High Incidence of Metabolic Syndrome in Midlife Women
- Formation of Through-Silicon-Vias Using Pressure Infiltration of Molten Tin
- Thermoelectric Thin Film Device of Cross-Plane Configuration Processed by Electrodeposition and Flip-Chip Bonding
- Thermoelectric Characteristics of n-Type Bi_2Te_3 and p-Type Sb_2Te_3 Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications