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Department of Electrical Engineering, National University of Kaohsiung | 論文
- The Reliability Characteristics of Wafer-Level Chip-Scale Package under Various Current Stressing
- Embedded Process and Characterization Analysis of Discrete Capacitor in Organic-Base Substrate
- Impacts of Layout Dimensions and Ambient Temperatures on Silicon Based On-Chip RF Interconnects
- Extra Bonus on Transistor Optimization with Stress Enhanced Notch-gate Technology for sub-90nm CMOSFET
- Effects of Sintering Processes on Composite Tool Steels Containing Self-synthesized TiC
- Large Area of Ultraviolet GaN-Based Photonic Quasicrystal Laser
- Inductively Coupled Plasma Reactive Ion Etching-Induced GaN Defect Studied by Schottky Current Transport Analysis
- High Optical-Gain AlGaN/GaN 2 Dimensional Electron Gas Photodetectors
- Thermal Annealing Effect of Indium Tin Oxide Contact to GaN Light-Emitting Diodes
- Thermal Annealing Effect Between Ni Film and Mg-Doped GaN Layer
- Enhancement of Light Output Power of InGaN/GaN Multiple Quantum Well Light-Emitting Diodes by Titanium Dioxide Texturing