スポンサーリンク
Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan | 論文
- Serum Deprivation-Induced Apoptosis in Cultured Porcine Granulosa Cells Is Characterized by Increased Expression of p53 Protein, Fas Antigen and Fas Ligand and by Decreased Expression of PCNA
- Low Power and High Sensitivity MRAM Sensing Scheme with Body Biased Preamplifier
- Estimation of Wire Length Distribution for Evaluating Performance Improvement of Three-Dimensional LSI
- Retinal Prosthesis System with Telemetry Circuit Controlled by Human Eyelid Movement
- Stabilization of Carboxylate Anion with a NH・・・O Hydrogen Bond : Facilitation of the Deprotonation of Carboxylic Acid by the Neighboring Amide NH Groups
- Transition of Mechanical Property of Porous Alginate Scaffold with Cells during Culture Period(CELL AND TISSUE ENGINEERING, Advances in Biomedical Science and Engineering)
- Effect of mixing condition of additives on the solidification of green body by gelcasting method
- New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration
- Covered Stent Treatment for Traumatic Cervical Carotid Artery Aneurysms : Two Case Reports
- Aneurysms of the Cervical Internal Carotid Artery: Experience in Surgical and Intravascular Management
- Intraventricular Aneurysms : Three Case Reports
- A single-dose regimen for antimicrobial prophylaxis to prevent perioperative infection in urological clean and clean-contaminated surgery
- Evaluation of Electrical Stimulus Current Applied to Retina Cells for Retinal Prosthesis
- Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs
- New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration
- Quantitative Derivation and Evaluation of Wire Length Distribution in Three-Dimensional Integrated Circuits Using Simulated Quenching
- Low-Power and High-Sensitivity Magnetoresistive Random Access Memory Sensing Scheme with Body-Biased Preamplifier
- Vision Chip with Electrical Fovea Motion
- Three-Dimensionally Stacked Analog Retinal Prosthesis Chip
- Surface Plasmon-Mediated Light Emission from Dye Layer in Reverse Attenuated Total Reflection Geometry