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Department Of Manufacturing Science Graduate School Of Engineering Osaka University | 論文
- Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases
- Laser Cladding of Fe-Cr-C Alloys on A5052 Aluminum Alloy Using Diode Laser
- Tensile Strength and Pseudo-elasticity of YAG Laser Spot Melted Ti-Ni Shape Memory Alloy Wires
- BCD-08 DYNAMIC ANALYSIS OF TIMING CHAIN LOAD FOR AUTOMOTIVE ENGINES(BELT AND CHAIN DRIVES)
- AN-P6 Effect of fibroblast cell which grew on amphiphilic polymer particle on the proliferation and differentiation of blood progenitor cell(Section I Animal and Plant Cell Cultures)
- Scanning Electron Microscopic Study of Vascular and Biliary Casts in Chicken and Duck Liver
- Secondary Lymphoid Areas in Calf Ileal Peyer's Patch(Anatomy)
- Class swith recombination of the chicken lgh chain genes: implications for the primordial switch region repeats
- New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
- Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive
- The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
- Comparison of Five Evaluation Methods of Residual Stress in a Welded Pipe Joint
- Microstructure and Tensile Strength of Stainless Steel Wires Micro Spot Melted by YAG Laser
- Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
- Laser Graphic Video Display using Silicon Scanning Mirrors with Vertical Comb Fingers
- Characterization of Silicon Scanning Mirror for Laser Display
- Dependence of Subthreshold Hump and Reverse Narrow Channel Effect on the Gate Length by Suppression of Transient Enhanced Diffusion at Trench Isolation Edge
- Dependence of Sub-Threshold Hump and RNWE Characteristics on the Gate Length by TED
- Purification and Characterization of Organic Solvent-Stable Protease from Organic Solvent-Tolerant Pseudomonas aeruginosa PST-01
- Properties of Solder Joints Using Sn-Ag-Bi-In Solder