Zhu Zhangming | School of Microelectronics, Xidian University

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概要

• Zhu Zhangmingの詳細を見る
• 同名の論文著者
• School of Microelectronics, Xidian Universityの論文著者

関連著者

• Zhu Zhangming

  School of Microelectronics, Xidian University

• YANG Yintang

  School of Microelectronic, Xidian University

• Liu Xiaoxian

  School of Microelectronics, Xidian University

• Gu Huaxi

  School of Telecommunications Engineering, Xidian University

• Ding Ruixue

  School of Microelectronics, Xidian University

• Wang Fengjuan

  School of Microelectronics, Xidian University

• Luo Jun

  School Of Material Eng. Soochow University

• Hao Yue

  School of Microelectronics, Xidian University

• Chen Haoran

  School of Microelectronics, Xidian University

• Liu Lianxi

  School of Microelectronics, Xidian University

• ZHAO Yang

  School of Communication Engineering, Jilin University

• Wang Jingmin

  School of Microelectronics, Xidian University

• Yang Zheng

  School of Microelectronics, Xidian University

• Wang Jingyu

  School of Microelectronics, Xidian University

• Yu Guangwen

  School of Microelectronics, Xidian University

• Yang Yintang

  School of Microelectronics, Xidian University

• Deng Shijie

  School of Microelectronics, Xidian University

• Zhuang Haoyu

  School of Microelectronics, Xidian University

• Liang Liang

  School of Microelectronics, Xidian University

• Yang Lin'an

  School of Microelectronics, Xidian University

• Li Yanhong

  School of Microelectronics, Xidian University

• Li Yani

  School of Microelectronics, Xidian University

• Yang Linan

  School of Microelectronics, Xidian University

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著作論文

• A fast-locking low-jitter pulsewidth control loop for high-speed pipelined ADC
• A CMOS OTA with Extremely Large DC Open-loop Voltage Gain
• Reduction of Signal Reflection in High-Frequency Three-Dimensional (3D) Integration Circuits
• A new stereo enhancement circuit for class-D amplifier
• The impact of trapping centers on AlGaN/GaN resonant tunneling diode
• Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV)
• Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV)
• A Highly Efficient Interface Circuit for Ultra-Low-Voltage Energy Harvesting
• Erratum: The impact of trapping centers on AlGaN/GaN resonant tunneling diode [IEICE Electronics Express Vol. 10 (2013) No. 19 pp. 20130588]

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