Wang Fengjuan | School of Microelectronics, Xidian University

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概要

• Wang Fengjuanの詳細を見る
• 同名の論文著者
• School of Microelectronics, Xidian Universityの論文著者

関連著者

• Liu Xiaoxian

  School of Microelectronics, Xidian University

• Zhu Zhangming

  School of Microelectronics, Xidian University

• YANG Yintang

  School of Microelectronic, Xidian University

• Ding Ruixue

  School of Microelectronics, Xidian University

• Wang Fengjuan

  School of Microelectronics, Xidian University

著作論文

• Reduction of Signal Reflection in High-Frequency Three-Dimensional (3D) Integration Circuits
• Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV)
• Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV)

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