Takenaka Mitsuru | The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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概要
The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan | 論文
- Modified Diffusion Bonding of Chemical Mechanical Polishing Cu at 150 °C at Ambient Pressure
- Ultra-Low Power Event-Driven Wireless Sensor Node Using Piezoelectric Accelerometer for Health Monitoring
- Impact of Reflow on the Output Characteristics of Piezoelectric Microelectromechanical System Devices
- Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology
- Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation