Ohba Takayuki | The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
スポンサーリンク
概要
関連著者
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Nakamura Tomoji
Fujitsu Lab. Ltd.
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KITADA Hideki
Fujitsu Laboratories Ltd
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Ohba Takayuki
The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Mizushima Yoriko
Fujitsu Laboratories Ltd., Akiruno Technology Center, 50 Fuchigami, Akiruno, Tokyo 197-0833, Japan
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Mizushima Yoriko
Fujitsu Laboratories Ltd., Atsugi, Kanagawa 243-0197, Japan
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Maeda Nobuhide
The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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NAKATA Yoshihiro
Fujitsu Laboratories Ltd.
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Fujimoto Koji
Dai Nippon Printing, Kashiwa, Chiba 277-0871, Japan
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Kitada Hideki
Fujitsu Laboratories Ltd., Atsugi, Kanagawa 243-0197, Japan
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Koshikawa Kazushige
Hamamatsu Photonics K.K., Hamamatsu 431-3196, Japan
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Suzuki Shinsuke
Hamamatsu Photonics K.K., Hamamatsu 431-3196, Japan
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Nakamura Tomoji
Fujitsu Laboratories Ltd., Atsugi, Kanagawa 243-0197, Japan
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Uchibori Chihiro
Fujitsu Laboratories Ltd., Atsugi, Kanagawa 243-0197, Japan
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Kodama Shoichi
The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Kim Youngsuk
The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Fujimoto Koji
The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Yoshimi Seiichi
The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
著作論文
- Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology
- Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation
- Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure